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documentation/Reference-Platform/Platforms/Consumer/PreviousReleases/RPB_16.06/Highlights.md
Robert Wolff 3061f152f8 Many moves of core docs 
Many documents were moved from high level
folder to new lower levels within each platform.
These docs have been kept in both folder temporarily.

Signed-off-by: Robert Wolff <robert.wolff@linaro.org>
2016-12-08 11:56:44 -08:00

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Highlights for 16.06 release:

Consumer and Enterprise Edition:

Kernel

  • Unified tree shared between the CE and EE builds.
  • 4.4.11-based, including some under-review topic branches to extend the features and platform hardware support.
  • Device-Tree support for CE; ARM ACPI and PCIe support for Enterprise.
  • Added OP-TEE support
    • Enabled on HiKey and Juno-r1
  • Supports Reference HW platforms HiKey and Cello
    • Other Test Platforms include: Dragonboard 410c, Hisilicon D02 and D03, APM X-Gene, HP Proliant m400, AMD Overdrive, Qualcomm QDF2432 Server Development Platform, and Cavium ThunderX.
  • Single kernel config for all platforms in arch/arm64/configs/distro.config
  • Single kernel binary (package) for all platforms

Bootloader

  • UEFI OpenPlatformPkg (upstream) now contains reference implementations for Huawei D02/D03, AMD Overdrive and LeMaker Cello
  • U-boot support in DB410c images to allow easier handling of images
Consumer Edition:

Reference hardware platform:

  • LeMaker Hikey

Other supported test platforms:

  • Dragonboard 410c

Overall CE Debian platform features, validated as part of the release:

  • UEFI with DT
  • Upgrade to Debian 8.5 "Jessie"
  • Upgrade to the unified 4.4.11 Linux Kernel
  • Upgrade graphics components: Mesa 11.1.2 and XServer 1.17.3a
  • Rootfs automatically resized during the first boot

CE Debian RPB for HiKey:

  • OP-TEE integrated by default
  • UEFI updated to use the latest development trees based on Tianocore
    • OpenPlatformPkg

CE Debian build for DragonBoard™ 410c:

  • U-boot chain-loaded from LK

CE OE/Yocto RPB:

  • First OpenEmbedded-based RPB, including several changes and components merged from the LHG OE layers
  • Dragonboard 410c and HiKey support
  • HiKey features:
    • OP-TEE initial support
    • Mali support for HiKey
  • Dragonboard 410c features:
    • GPU, WLAN, BT, audio, LS I/O, camera and GPS
Enterprise Edition

Reference hardware platform:

  • LeMaker Cello

Other supported test platforms:

  • AMD Overdrive A0 and B0
  • Hisilicon D02
  • Hisilicon D03 (new)
  • APM X-Gene Mustang
  • HP ProLiant m400
  • Qualcomm QDF2432 Server Development Platform (new)
  • Cavium ThunderX (new)

Overall platform features, validated as part of the release:

  • UEFI with ACPI
  • KVM
  • PCIe

Firmware:

  • UEFI OpenPlatformPkg (upstream) now contains reference implementation for Huawei D02/D03, AMD Overdrive and LeMaker Cello

Network Installers:

  • Debian:
    • Upgrade to Debian 8.5 "Jessie"
    • Use the unified 4.4.11 kernel
  • CentOS
    • Based on CentOS 7.2 16.03
    • Use the unified 4.4.11 kernel

Enterprise Components:

  • Docker 1.9.1
  • OpenStack Liberty for Debian Jessie and CentOS
  • ODPi 1.0.0 based Hadoop
  • Spark 1.3.1
  • OpenJDK 8
  • QEMU 2.6